Risk Letters

Exploited vulnerability

CVE-2021-1905

TLP:CLEAR

Qualcomm Multiple Chipsets Use-After-Free Vulnerability

Multiple Qualcomm Chipsets contain a use after free vulnerability due to improper handling of memory mapping of multiple processes simultaneously.

Facts

  • Vendor: Qualcomm
  • Product: Multiple Chipsets
  • CVSS: 8.4
  • EPSS (probability of exploitation within 30 days): 1.5 %
  • On CISA's Known Exploited Vulnerabilities list since: 3 November 2021
  • First known exploitation: 3 November 2021
  • CISA's deadline for US federal agencies: 3 May 2022
  • Weakness: CWE-416
  • First seen by Risk Letters: 3 November 2021

Members see which Nordic sectors the flaw hits, and what to do about it.

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Data: NVD (public domain), CISA KEV, FIRST EPSS, MITRE ATT&CK, AlienVault OTX. NVD