Risk Letters

Exploited vulnerability

CVE-2023-33107

TLP:CLEAR

Qualcomm Multiple Chipsets Integer Overflow Vulnerability

Multiple Qualcomm chipsets contain an integer overflow vulnerability due to memory corruption in Graphics Linux while assigning shared virtual memory region during IOCTL call.

Facts

  • Vendor: Qualcomm
  • Product: Multiple Chipsets
  • CVSS: 8.4
  • EPSS (probability of exploitation within 30 days): 0.7 %
  • On CISA's Known Exploited Vulnerabilities list since: 5 December 2023
  • First known exploitation: 5 December 2023
  • CISA's deadline for US federal agencies: 26 December 2023
  • Weakness: CWE-190
  • First seen by Risk Letters: 5 December 2023

Members see which Nordic sectors the flaw hits, and what to do about it.

Get the full brief

Data: NVD (public domain), CISA KEV, FIRST EPSS, MITRE ATT&CK, AlienVault OTX. NVD