Risk Letters

Exploited vulnerability

CVE-2022-22071

TLP:CLEAR

Qualcomm Multiple Chipsets Use-After-Free Vulnerability

Multiple Qualcomm chipsets contain a use-after-free vulnerability when process shell memory is freed using IOCTL munmap call and process initialization is in progress.

Facts

  • Vendor: Qualcomm
  • Product: Multiple Chipsets
  • CVSS: 8.4
  • EPSS (probability of exploitation within 30 days): 0.4 %
  • On CISA's Known Exploited Vulnerabilities list since: 5 December 2023
  • First known exploitation: 5 December 2023
  • CISA's deadline for US federal agencies: 26 December 2023
  • Weakness: CWE-416
  • First seen by Risk Letters: 5 December 2023

Members see which Nordic sectors the flaw hits, and what to do about it.

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Data: NVD (public domain), CISA KEV, FIRST EPSS, MITRE ATT&CK, AlienVault OTX. NVD