Risk Letters

Exploited vulnerability

CVE-2023-33063

TLP:CLEAR

Qualcomm Multiple Chipsets Use-After-Free Vulnerability

Multiple Qualcomm chipsets contain a use-after-free vulnerability due to memory corruption in DSP Services during a remote call from HLOS to DSP.

Facts

  • Vendor: Qualcomm
  • Product: Multiple Chipsets
  • CVSS: 7.8
  • EPSS (probability of exploitation within 30 days): 0.7 %
  • On CISA's Known Exploited Vulnerabilities list since: 5 December 2023
  • First known exploitation: 5 December 2023
  • CISA's deadline for US federal agencies: 26 December 2023
  • Weakness: CWE-416
  • First seen by Risk Letters: 5 December 2023

Members see which Nordic sectors the flaw hits, and what to do about it.

Get the full brief

Data: NVD (public domain), CISA KEV, FIRST EPSS, MITRE ATT&CK, AlienVault OTX. NVD